diamond grit grinding wheel apply to optical instrument industry

Just fill in the form below, click submit, you will get the price list, and we will contact you within one working day. Please also feel free to contact us via email or phone. (* is required).

  • An Introduction to the Optics Manufacturing Process

    Hybrid metal-resin-bonded diamond wheel has more advantages for ultraprecision machining of optical glass than the usually used resin- or metal-bonded diamond grinding wheel.

    Get Price
  • Overview of Diamond Polishing - University of Sydney

    2019-8-5 · A catalytic grinding wheel was developed by Tsai et al. [2007] to shorten the polishing time and decrease surface roughness of a diamond film [Tsai et al., 2007]. Cast iron was used as the binder in the primary diamond grinding wheel and acted as catalyst. Thus, a

    Get Price
  • RECONSTRUCTION AND CHARACTERIZATION OF

    2013-4-24 · the results, reconstruction of the topography by the application of stereo photogrammetry is considered a suitable method for detailed 3D visualisation and quantification of a pulp stone surface or single grits in them. Topographic changes obtained in a grinding wheel and grit, for instance by dressing or by grinding, can be visualised

    Get Price
  • An Introduction to the Optics Manufacturing Process

    2021-8-12 · Saint-Gobain Surface Conditioning offers a full range of diamond and CBN products for superabrasive wheels and grinding tools. From precision grinding to critical finishing, Saint-Gobain’s highly engineered diamond and CBN abrasive powders deliver consistent and reliable performance in technically demanding wheel and tool applications.

    Get Price
  • Lapping and Polishing Basics - South Bay Tech

    Hybrid metal-resin-bonded diamond wheel has more advantages for ultraprecision machining of optical glass than the usually used resin- or metal-bonded diamond grinding wheel.

    Get Price
  • Diamond tools for the semiconductor industry - Saint

    2018-12-10 · rod grinding Tool diamond wheel for cylindrical grinding. Benefits Cost-effective operation by fast material removal. Minimal influence on crystalline structure. Machines e.g. UEDA GIKEN (1 or 2 spindles), or cylindrical grinding machines. Program Type D W T X H*) Machine e.g. mm mm mm mm mm K6A2 75 4 6 UEDA GIKEN with Winter adapter K1A1 300 ...

    Get Price
  • Overview of Diamond Polishing - University of Sydney

    2019-8-5 · A catalytic grinding wheel was developed by Tsai et al. [2007] to shorten the polishing time and decrease surface roughness of a diamond film [Tsai et al., 2007]. Cast iron was used as the binder in the primary diamond grinding wheel and acted as catalyst. Thus, a

    Get Price
  • Lapping and Polishing Basics - South Bay Tech

    DiaPoint provides a wide-range of standard Diamond Dressers, such as: Single Point, Multi Point, Impregnated, Chisel, CVD and PCD inserts, Coned and Blade type. DiaPoint also specializes in providing Tailor-made Dressers for special machinery and processes. We design and manufacture dressers as per customers’ requirements.

    Get Price
  • Diamond tools for the semiconductor industry - Saint

    2018-12-10 · rod grinding Tool diamond wheel for cylindrical grinding. Benefits Cost-effective operation by fast material removal. Minimal influence on crystalline structure. Machines e.g. UEDA GIKEN (1 or 2 spindles), or cylindrical grinding machines. Program Type D W T X H*) Machine e.g. mm mm mm mm mm K6A2 75 4 6 UEDA GIKEN with Winter adapter K1A1 300 ...

    Get Price
  • Form deviation plus roughness Characterization of

    To achieve (1) to (4) in the shortest possible grinding time. Concerning aspect (3), the ground roughness is influenced by multiple factors, strong depending on the type of grinding wheel that is used, the bonding system & openness achieved by the manufacturing of the wheel, the grinding type of grit & wheel …

    Get Price
  • P2X Material Performance Study Whitepaper rev0719

    2020-11-26 · the application of stylus contact based surface measure-ment instruments. Although stylus type instruments are suitable for many applications and well accepted throughout industry, challenges can arise due to the mechanical contact with the sample, as surface or instrument damage may occur. Thus for applications, where tactile techniques

    Get Price
  • Grinding induced subsurface cracks in silicon wafers

    1992-4-1 · The grinding force (normal) generated whilst ductile machining was significantly greater than for brittle fracture grinding. The work described in this paper reveals a significant advance in the machining of optical glass. This novel and complex process requires further investigation to provide a full understanding of the science involved.

    Get Price